Submissions are welcomed on any topic pertaining to temperature-aware architecture, including but not limited to:

• Modeling and validation
• Thermal implications of novel architectures, design styles, or technologies
• Dynamic thermal management for the CPU, CMPs, SoCs, other system components, clusters, data centers, etc.
• Circuit/architecture/OS cooperation
• Scheduling techniques
• Sensitivity of other metrics to operating temperature
• Application-specific thermal optimizations
• New benchmark applications and sampling techniques for thermal studies
• Workload characterization
• Interaction of thermal management, energy efficiency (especially leakage), and voltage stability
• Interaction of thermal management and other runtime optimizations
• All architecture-related aspects of temperature-dependent reliability effects
• Interaction of thermal management with real-time requirements
• Interaction of manufacturing, packaging, and cooling with architecture
• Architecture impacts of novel cooling techniques (from chip-level to data-center level)
• New thermal-sensor architectures
• Position papers suggesting how thermal engineers and architects can collaborate, preferably with concrete examples.
• Tutorial or survey papers explaining essential thermal-engineering concepts in a practical way that is useful for computer architecture research.

We especially encourage submissions involving collaboration between architects and thermal engineers! In fact, the goal of this workshop is to stimulate the widest possible collaboration among architects and other engineers on topics related to temperature-aware design.

The paper should be in IEEE conference format and at most ten pages in length including all figures, references, etc. Excessively long papers will be rejected without review.

Submission deadline:

To align our deadline with those of some other ISCA workshops, we are moving the submission deadline to April 19, 2006

Author notification: April 30, 2006
Final manuscripts: May 31, 2006

Please send questions and paper submissions to: skadron |at| cs DOT virginia DOT edu